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  • The tire mold is an important tool used in the tire production process (vulcanization process). There are some patterns in the tire mold (corresponding to the tire pattern), and long-term use will produce many deposits, such as sulfide, inorganic matter, silicone oil, carbon black, etc. Therefore, it needs to be cleaned regularly to ensure the cleanliness of the surface. However, due to the irregular and complex patterns of the mold, the general cleaning method has not been cleaned in place, and some parts will form a dirty corner, which will affect the quality of the tire.
    07-12
    2021
    2021-07-12
  • The mechanism of laser cleaning is mainly based on the fact that the contaminants on the surface of the object absorb the laser energy, or vaporize and volatilize, or instantaneously heat and expand to overcome the adsorption force of the particles on the surface, and make it detach from the surface of the object, thereby achieving the purpose of cleaning;
    07-12
    2021
    2021-07-12
  • Laser cleaning technology was used in the early 1990s, and subsequently played an increasingly important role in the protection and cleaning of cultural relics. Laser cleaning technology can be applied to a large number of unearthed cultural relics or architectural monuments that are difficult to clean, large in scale, and require no damage during the cleaning process.
    07-12
    2021
    2021-07-12
  • The English name of the laser is LASER, which is an acronym for "light amplification by stimulated emission of radiation".
    07-12
    2021
    2021-07-12
  • The principle of laser cleaning is to use high-frequency and high-energy laser pulses to irradiate the surface of the workpiece. The coating layer can instantly absorb the focused laser energy, so that the oil, rust or coating on the surface can be evaporated or peeled off instantly, which can effectively remove surface attachments or surfaces at a high speed. The cleaning method of the coating, and the laser pulse with a short action time, will not damage the metal substrate under the appropriate parameters.
    07-12
    2021
    2021-07-12
  • At present, as semiconductor technology continues to shrink, advanced integrated circuit devices have been transformed from planar to three-dimensional structures, and integrated circuit manufacturing processes are becoming more and more complex, often requiring hundreds or even thousands of process steps. For advanced semiconductor device manufacturing, after each process, there will be more or less particulate contaminants, metal residues or organic residues on the surface of the silicon wafer. The continuous shrinking of device feature sizes and the increasing complexity of three-dimensional device structures make semiconductors Devices are becoming more and more sensitive to particle contamination, impurity concentration and quantity. Higher requirements are put forward for the cleaning technology of the pollution particles on the mask surface on the silicon wafer. The key point is to overcome the great adsorption force between the pollution particles and the substrate. The traditional chemical cleaning, mechanical cleaning, and ultrasonic cleaning None of the methods can meet the demand, and laser cleaning can easily solve this type of pollution problem.
    07-09
    2021
    2021-07-09
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