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Laser cleaning solutions for the semiconductor industry

Laser cleaning solutions for the semiconductor industry

  • Categories:Industry News
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  • Time of issue:2021-07-09 17:09
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(Summary description)At present, as semiconductor technology continues to shrink, advanced integrated circuit devices have been transformed from planar to three-dimensional structures, and integrated circuit manufacturing processes are becoming more and more complex, often requiring hundreds or even thousands of process steps. For advanced semiconductor device manufacturing, after each process, there will be more or less particulate contaminants, metal residues or organic residues on the surface of the silicon wafer. The continuous shrinking of device feature sizes and the increasing complexity of three-dimensional device structures make semiconductors Devices are becoming more and more sensitive to particle contamination, impurity concentration and quantity. Higher requirements are put forward for the cleaning technology of the pollution particles on the mask surface on the silicon wafer. The key point is to overcome the great adsorption force between the pollution particles and the substrate. The traditional chemical cleaning, mechanical cleaning, and ultrasonic cleaning None of the methods can meet the demand, and laser cleaning can easily solve this type of pollution problem.

Laser cleaning solutions for the semiconductor industry

(Summary description)At present, as semiconductor technology continues to shrink, advanced integrated circuit devices have been transformed from planar to three-dimensional structures, and integrated circuit manufacturing processes are becoming more and more complex, often requiring hundreds or even thousands of process steps. For advanced semiconductor device manufacturing, after each process, there will be more or less particulate contaminants, metal residues or organic residues on the surface of the silicon wafer. The continuous shrinking of device feature sizes and the increasing complexity of three-dimensional device structures make semiconductors Devices are becoming more and more sensitive to particle contamination, impurity concentration and quantity. Higher requirements are put forward for the cleaning technology of the pollution particles on the mask surface on the silicon wafer. The key point is to overcome the great adsorption force between the pollution particles and the substrate. The traditional chemical cleaning, mechanical cleaning, and ultrasonic cleaning None of the methods can meet the demand, and laser cleaning can easily solve this type of pollution problem.

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2021-07-09 17:09
  • Views:
Information

At present, as semiconductor technology continues to shrink, advanced integrated circuit devices have been transformed from planar to three-dimensional structures, and integrated circuit manufacturing processes are becoming more and more complex, often requiring hundreds or even thousands of process steps. For advanced semiconductor device manufacturing, after each process, there will be more or less particulate contaminants, metal residues or organic residues on the surface of the silicon wafer. The continuous shrinking of device feature sizes and the increasing complexity of three-dimensional device structures make semiconductors Devices are becoming more and more sensitive to particle contamination, impurity concentration and quantity. Higher requirements are put forward for the cleaning technology of the pollution particles on the mask surface on the silicon wafer. The key point is to overcome the great adsorption force between the pollution particles and the substrate. The traditional chemical cleaning, mechanical cleaning, and ultrasonic cleaning None of the methods can meet the demand, and laser cleaning can easily solve this type of pollution problem.

In addition, as the size of integrated circuit devices continues to shrink, material loss and surface roughness during the cleaning process have become issues that must be paid attention to. The removal of particles without material loss and pattern damage is the most basic requirement. Laser cleaning technology has non- Contact, no thermal effect, no surface damage to the object to be cleaned, and no secondary pollution and other advantages unmatched by traditional cleaning methods, it is the best cleaning method to solve the pollution of semiconductor devices.

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